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high-tech pcb production embedded assembly components for sale

high-tech pcb production embedded assembly components for sale
  • high-tech pcb production embedded assembly components for sale
  • high-tech pcb production embedded assembly components for sale
  • high-tech pcb production embedded assembly components for sale
  • high-tech pcb production embedded assembly components for sale
  • high-tech pcb production embedded assembly components for sale
  • high-tech pcb production embedded assembly components for sale

high-tech pcb production embedded assembly components for sale

pcb production is painstakingly created by a team of artisans. It makes the interconnections less bulky
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Company Advantages
1. pcb production is painstakingly created by a team of artisans. It makes the interconnections less bulky
2. Strict quality assurance ensures the higher performance of pcb production. It is hard to find any short circuits in this product
3. The product has good structural integrity. It is not prone to deform or warp or crack during use due to its high materials rigidity. Its connections made automatically through copper tracks
4. The product has the desired durability. It has passed the drop test to evaluate how well it can withstand impacts and pressure. Its parts are spaced evenly and traces are symmetric and uniform

high-tech pcb production embedded assembly components for sale-1

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Passive and active chips can be embedded in PCB using two basic processes: face-down and face-down. The two variants differ in the way components are connected to the outside world and use different materials and processes. Figure 1 outlines these two approaches.

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In the front process, the component is placed on the carrier material, and the contact pad of the component can be seen after assembly. This method provides some very good thermal performance and is very suitable for power module embedding. Processing constraints are encountered when trying to embed components with variable thickness. After embedding, the dielectric thickness between the component surface and the external copper surface remains unchanged, which poses a challenge to the subsequent micro-laser drilling and copper plating technology, especially in the case of via filling.

In the face-down process, the component and the component image are assembled together into the carrier material. Normally, screen-printed non-conductive adhesives are used as carriers for fixing components. This method has several advantages: good thickness control of dielectric materials between components and carriers, and good registration accuracy in assembly process. The reason for the improvement of alignment capability comes from the fact that the camera of the assembly machine can see the image of the component, so it can be aligned before the assembly is completed.

In frontal technology, the camera is aligned to the contour of the component.

Using face-down technology, several components of different thickness can be embedded into the FR-4 core. The prepreg used for embedding is removed to form a cavity around the assembly. Prepregs with openings are stacked to the height of the assembly and are provided with non-openings at the top. By opening the dielectrics to various heights of the components, usually ranging from 100 to 350 um, it is easy to achieve different thickness embedding. Then, the embedded kernel can be used as the standard inner core and included in the PCB multi-layer structure. External SMD components can then be assembled on both sides of an embedded PCB to form very high-density modules/components (see Figure 2).

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Embedded capacitors have many advantages, such as saving surface space, improving the product rate of device assembly, reducing power supply noise, reducing electromagnetic interference, simplifying circuit board design, and also raising higher challenges to equipment processing technology.

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Product FEATURES


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  ◪   Reduce surface mounting area by embedding chip components (resistors/capacitors)

  ◪   Improve electrical performance by shortening the wiring distance between surface-mounted ICS and embedded components

  ◪   Shorten the space between components and better heat resistance can be achieved by using a connection between the laser through holes and the copper-plated component terminals



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. These years, Rocket PCB Solution Ltd. has achieved fast business development in pcb production field.
2. The quality of prototype pcb meets international standards.
3. We are committed to adding value to our customers. Through analyzing the marketplace, we can identify opportunities to adapt our products or services to our changing marketplace, hence we can offer customers the most targeted solutions.
Rocket PCB pcb production is fabricated using premium quality raw material and latest technology. It can perfectly fit for the applied electronic equipment, leaving no gap
Rocket PCB pcb production is made of materials that are purchased from reputed suppliers. The brand name can be printed on the product
The materials of Rocket PCB pcb production are sourced from reputed and trusted vendors of the industry. Constructed with gold-plated connectors, it has optimal signal clarity
Rocket PCB prototype pcb is available in diverse attractive design styles. Its light weight contributes to its strong portability
Rocket PCB prototype pcb assembly is precisely manufactured by using top-grade raw materials and advanced machines. The aluminum shell can protect the product from scratching
It has gone through a number of quality checks before shipping. Its Ethernet port can handle Gigabit speeds of 10/100/1000Mbps, which ensures stable and fast network connection
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