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high-tech pcb printed circuit board buried capacitors for wholesale

high-tech pcb printed circuit board buried capacitors for wholesale
  • high-tech pcb printed circuit board buried capacitors for wholesale
  • high-tech pcb printed circuit board buried capacitors for wholesale
  • high-tech pcb printed circuit board buried capacitors for wholesale
  • high-tech pcb printed circuit board buried capacitors for wholesale
  • high-tech pcb printed circuit board buried capacitors for wholesale
  • high-tech pcb printed circuit board buried capacitors for wholesale

high-tech pcb printed circuit board buried capacitors for wholesale

The purifying technology of Rocket PCB pcb printed circuit board has been optimized. It is carried out by our engineers who try to achieve the great purifying effect while shortening the time. The nature of stainless steel makes this product ideal for use in hygienic applications
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high-tech pcb printed circuit board buried capacitors for wholesale-1

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Passive and active chips can be embedded in PCB using two basic processes: face-down and face-down. The two variants differ in the way components are connected to the outside world and use different materials and processes. Figure 1 outlines these two approaches.

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In the front process, the component is placed on the carrier material, and the contact pad of the component can be seen after assembly. This method provides some very good thermal performance and is very suitable for power module embedding. Processing constraints are encountered when trying to embed components with variable thickness. After embedding, the dielectric thickness between the component surface and the external copper surface remains unchanged, which poses a challenge to the subsequent micro-laser drilling and copper plating technology, especially in the case of via filling.

In the face-down process, the component and the component image are assembled together into the carrier material. Normally, screen-printed non-conductive adhesives are used as carriers for fixing components. This method has several advantages: good thickness control of dielectric materials between components and carriers, and good registration accuracy in assembly process. The reason for the improvement of alignment capability comes from the fact that the camera of the assembly machine can see the image of the component, so it can be aligned before the assembly is completed.

In frontal technology, the camera is aligned to the contour of the component.

Using face-down technology, several components of different thickness can be embedded into the FR-4 core. The prepreg used for embedding is removed to form a cavity around the assembly. Prepregs with openings are stacked to the height of the assembly and are provided with non-openings at the top. By opening the dielectrics to various heights of the components, usually ranging from 100 to 350 um, it is easy to achieve different thickness embedding. Then, the embedded kernel can be used as the standard inner core and included in the PCB multi-layer structure. External SMD components can then be assembled on both sides of an embedded PCB to form very high-density modules/components (see Figure 2).

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Embedded capacitors have many advantages, such as saving surface space, improving the product rate of device assembly, reducing power supply noise, reducing electromagnetic interference, simplifying circuit board design, and also raising higher challenges to equipment processing technology.

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Product FEATURES


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  ◪   Reduce surface mounting area by embedding chip components (resistors/capacitors)

  ◪   Improve electrical performance by shortening the wiring distance between surface-mounted ICS and embedded components

  ◪   Shorten the space between components and better heat resistance can be achieved by using a connection between the laser through holes and the copper-plated component terminals



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Rocket PCB pcb printed circuit board is manufactured by a team of skilled workers who adopt advanced welding technology to ensure that all joints are neat and robust. The coating applied on its surface makes it resistant from oxidization
Rocket PCB pcb printed circuit board is developed by our R&D engineers who have developed systems that can reduce the harmful impacts of chemical refrigerants. Any scratch on its surface can be easily polished to hide the scratch
All manufacturing processes and test procedures of Rocket PCB pcb printed circuit board are strictly overseen by our professional workers according to the standards of building materials. It is also widely used in the aviation industry due to its added strength without adding too much weight
The development and design of Rocket PCB pcb printed circuit board is a complex process with medical industry regulations, specifications, application requirements, and patients' needs. It is also widely used in the aviation industry due to its added strength without adding too much weight
Rocket PCB [pcb printed circuit board is of high performance. It has undergone professional and strict spectral and photoelectric analysis to has high luminous efficiency. It has passed the standards of AISI, ASTM, GB, and DIN
The strict quality control system is adopted to provide a strong guarantee for the quality of the product. Its germ resistance makes this product ideal for use in hygienic applications such as kitchen, public restaurant, bathroom, etc
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