gold ic wire bonding surface finished for automotive Rocket PCB

Company Advantages
1. Compliance with recognized safety standards is necessary for Rocket PCB ic wire bonding to be recognized. These can be in the form of test reports from recognized testing laboratories.
2. The product is anti-snag. It is made of fabrics which are close-knitted and has intensified sewing quality so as to reduce the tendency of snagging.
3. Our mission in Rocket PCB Solution Ltd. is to satisfy our customers not only in quality but also in service.
4. Over the years, Rocket PCB Solution Ltd. has made great progress in productivity growth.

Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:

Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.

Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.

Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.

Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.

Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.

COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.

Company Features
1. Rocket PCB Solution Ltd. is one of the few professional printed circuit board industry supplier with independent R&D capabilities.
2. We have worked with people here and countless companies in China (and other regions). By emphasizing the importance of building a true relationship with each customer to ensure that we thoroughly understand all aspects of our business, we have received many repetitive purchases.
3. Rocket PCB now always holds the firm idea that customer satisfaction is in the first place. Inquire online! We are always fully prepared for our customers wire bonding technology . Inquire online! The Rocket PCB brand's consumption philosophy will profoundly lead the transformation of the industry. Inquire online!