HDI PCB fabrication | Any-layer PCB

Product Information

Company Advantages
1. Adopt of HDI PCB fabrication is the truly feasible body frame lightweight way. It offers a simple platform to arrange the electronic components in a compressed way
2. The product is widely used in the market for its fine characteristics and remarkable advantages. It is specifically designed to lessen the chances of shorts and wiring issues
3. The product features increased safety and reliability. Its design structure is scientific and ergonomic, which makes it function in a more reliable way. The product allows the installation and repair process to be convenient

Anylayer/ ELIC (Every layer interconnection)

In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH) is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.

Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

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ROCKET PCB Any Layer PCB （ELIC）process flow

Anylayer PCB DFM suggestion for layout

Product FEATURES

◪ Any Layer PCBs with laser vias and filled plating on each layer

◪ 0.4mm thin spacing CSP supported by Any layer interconnection

◪ Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

ROCKET PCB STRENGTH

SPECIALIZED MANUFACTURING

Conductive materials and core-to-core bonding
Embedded components
RF connector attachment
Laser direct imaging (LDI)
Laser etching
Laser forming
Multi-level cavity construction
Plated cavities and edges
Composite/hybrid Structures
N+N dual press-fit
Dual-drill
Bonding on metal core
Bulid-up HDI
Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

CAPABILITIES

3mil line and space
4mil laser defined vias
6mil chip-on-board
6mil mechanically drilled vias
Conductive and non-conductive via fill
Dual backdrilling
Sequential lamination
Mixed dielectric
Heatsink Bonding
Heavy copper/thermal vias
Blind/buried vias
Stacked and staggerd microvias

EXTENSIVE ANALYTICAL TESTING

Design Rules Check(DRC)
Electrical Testing
Automated Optical Inspection(AOI)
X-Ray
Plating thickness testing
Metalized vias inspection
Thermal shock testing
Surface peelability testing
Impedance control testing
100% visual inspection
Solderability testing
Ionic cleanliness testing
Metallographic microscopic analysis
High voltage testing
Insulating resistance testing

FEATURES

PTFE
High speed/low loss
High temperature
Low CTE
Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger
Combination surface finished
Copper-filled microvias

Product application

Consumer electronics

Automotive electronics

Communications

Energy

Industrial & Instrumentation

IOT/Smart Home

Medical electronics

Security Industry

Company Features
1. It is widely known that Rocket PCB is a one of Chinese leading brand in the field of any-layer pcb . pcb manufacturing process is processed with sophisticated technology and HDI PCB fabrication.
2. Both the quality of double layer pcb and technology reach international standards.
3. any-layer pcb enjoys a good reputation for its high quality which helps it develop its best performance. Rocket PCB Solution Ltd. is quality-oriented and customer-oriented. Get price!

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Product FEATURES

EXTENSIVE ANALYTICAL TESTING

Product application