To ensure reliability and efficiency of operation, heat must be removed from the power components that generate heat. Thermal management helps to elicit heat from the components of the heating system in a variety of application industries.
Heat Sink PCB provides a path for heat from the heat source to the outside or the inside medium. Heat sink PCBs can usually dissipate heat in three ways: conduction (Heat transfers from one solid to another), convection (Heat transfers from the solid to the moving fluid. For most power or LED applications, it would be transferred to air), radiation (Heat transfers from two objects with different surface temperature through thermal radiation).
◪ Electric power amplifiers
◪ DC, Power control systems
◪ RF and MW
◪ Motor control modules
◪ Electric braking systems
◪ EV power transmission system
◪ High-speed computing
◪ LED lighting systems
◪ Automotive, industrial and consumer goods
Rocket PCB offers a wide range of thermal management types including vias of farm heatsinks/pallets, heatsink coins, embedded coins, e-coins, Press Fit Coin (PFC), metal in-lay, solder or adhesive attach. Additionally, Rocket's Thermal Management Solutions include our patented embedded E-Coin technology, heatsink coin attachment and heavy copper. We specialize in RF & MW.
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