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circuit metal core pcb packaging for digital device Rocket PCB

circuit metal core pcb packaging for digital device Rocket PCB

IC substrates
Board thickness:
Surface treatment:
Immersion Gold
Microvia Manufacturing, patterning and copper plating control, product reliability test technology
L/C,T/T,Western Union
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
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Company Advantages
1. Rocket PCB pwb board is available in numerous design styles. Its parts are spaced evenly and traces are symmetric and uniform
2. At the base of quantitative analysis result, Rocket PCB Solution Ltd. has promoted the successful development of pwb board in this field. It plays an important role in modern electronic equipment
3. The product has a complete life cycle due to the strict testing which is in line with the internal and external standards. Thus, the product is durable in use for a long time. It takes less time in assembling a circuit as compared to the conventional method
4. The product meets international standards in all aspects, such as performance, durability, availability and more. It makes the interconnections less bulky
5. This product is widely recommended and valued for its superior quality and long-lasting performance. All the components within this product are fixed using solder flux
About our product

IC substrates serve as the connection between IC chip(s) and the PCB through a conductive network of traces and holes. IC substrates are endowed with critical functions including circuit support and protection, heat dissipation, and signal and power distribution.
IC substrates represent the highest level of miniaturization in PCB manufacturing and share many similarities with semiconductor manufacturing. Rocket PCB produces many types of IC substrates on which IC chips are attached to the IC substrate utilizing wire bonding or flip chip methods.

Advanced technology that Rocket PCB adopts for the IC substrates manufacturing includes:

  ◪   CSP (Chip Scale Packages)

  ◪   FC-CSP (Flip Chip) CSP

  ◪   COB (Chip on Board)

  ◪   PoP (Package on Package)

  ◪   COB (Chip on Board)

  ◪   PiP (Package in Package)

  ◪   SiP (System in Package)

  ◪   RF Module

  ◪   LED Package

Product application

Consumer electronics
Automotive electronics
Industrial & Instrumentation
IOT/Smart Home
Medical electronics
Security Industry

Company Features
1. Together with advanced facilities, Rocket PCB Solution Ltd. has established a sound quality control system and equipped with
2. Rocket PCB Solution Ltd. sticks to the concept of energy-conservation and environmental protection during manufacturing. Inquire now!
Product Message
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