bonding wire bonding technology professional for electronics Rocket PCB

Company Advantages
1. When manufacturing wire bonding technology , we also take simple pcb board into consideration.
2. We can guarantee quality for our wire bonding technology .
3. wire bonding technology are recognized for their merits of simple pcb board.
4. For Rocket PCB Solution Ltd., employees is the company's most valuable asset.
5. Rocket PCB wins numerous customer's trust by reliable quality and simple pcb board.

Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:

Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.

Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.

Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.

Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.

Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.

COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.

Company Features
1. Rocket PCB Solution Ltd. specializes in custom production of various wire bonding technology products for you.
2. Rocket PCB has its own high-tech labs to manufacture wire bonding .
3. By improving the crafts process, Rocket PCB aims to achieve the goal of mutual development between it and the wire bonding process industry. Welcome to visit our factory! The service of Rocket PCB helps us to win more trustworthy partners. Welcome to visit our factory!