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Bonding on Metal Base, metal core pcb, MCPCB,metal backed pcb


Typical Index

Process Capability

Typical value

Layers

≤6L

2L

material

RO4350B、RF35、RF35A2

RF35

Metal base

Copper, Aluminum

copper

Metal thk.

≤4.5mm

3.5mm

Bonding Material

LG1000、CF3350

LG1000

Metal Size

MAX:180mm*280mm

120mm*230mm

registration

±4mil  (metal to PCB) 

±4mil  (metal to PCB) 

Resin flow at cavity

±0.2mm

±0.2mm

Surface treatment

ENIG

ENIG

Bonding type

Full /Partial bonding,

Full sheet bonding

Application

Communication,  PA, RF


Bonding metal sink to PCB is a popular method for electronic thermal solutions. Depending on the electrical requirements, the bonding material can be a dielectric film or a conductive film.

Bonding PCB to metal via dielectric materials such as FR-4 prepreg can be used in a variety of applications. Because metal parts are usually machined and surface finished before bonding, the prepreg used is mostly of the non flow or low flow type to avoid excessive resin leakage into the module cavity. For RF power amplifier, the metal heat sink needs to be grounded through PCB, and the conductive film such as ablefilm cf-3350 is widely used.
As one of the world's top PCB manufacturers of mobile base station power amplifier, Rocket PCB has a high capacity in building metal coin press bonded PCB. We use laminate / dielectric suppliers including: isolata, nelco, Rogers & Taconic. Metals include aluminum, copper and brass composites.


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