Sweat-bonding PCB, copper-coin


Typical Index

Process Capability

Typical value

Layers

≤6L

2L

Base mtl.

RO4350B、RF35、RF35A2

RF35

Metal type

Copper, Aluminum

copper

Metal thk. 

2mm≤copper≤6mm

4.5mm≤Al≤8mm

3.5mm

Hole size in bonding area

≥0.6mm

1.0mm

Metal Size

Max. 200mm*300mm

120mm*230mm

registration

±4mil  (Metal to PCB) 

±4mil  (copper to PCB) 

Tin flow in cavity

±0.2mm

<0.1mm

Tin flow height

≤20um

<8um

Surface treatment

ENIG

ENIG

Bonding type

Full/partial bonding 

Full sheet bonding

Application

Communication, PA, RF

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