Bonding on Metal Base, metal core pcb


Typical Index

Process Capability

Typical value

Layers

≤6L

2L

material

RO4350B、RF35、RF35A2

RF35

Metal base

Copper, Aluminum

copper

Metal thk.

≤4.5mm

3.5mm

Bonding Material

LG1000、CF3350

LG1000

Metal Size

MAX:180mm*280mm

120mm*230mm

registration

±4mil  (metal to PCB) 

±4mil  (metal to PCB) 

Resin flow at cavity

±0.2mm

±0.2mm

Surface treatment

ENIG

ENIG

Bonding type

Full /Partial bonding,

Full sheet bonding

Application

Communication,  PA, RF

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